Intel's Lip-Bu Tan Discusses Possible AMD Cooperation, Lays Out CPU and Foundry

Intel CEO Lip-Bu Tan has spoken with AMD CEO Lisa Su about exploring potential areas of cooperation. Tan brought it up during an October 24 fireside chat with Jimmy Cheng, president of the Chinese American Semiconductor Professional Association (CASPA), though he didn't say what those areas are, and neither company has announced anything. AMD was earlier reported to be evaluating Intel's 14A node, so foundry work seems like an obvious guess. However, it could just as well be packaging, software, or something else entirely.

Most of the chat was about Intel's own turnaround. Tan reportedly said Intel has to "reclaim the leadership in CPU" and that it will now tailor chips like Xeon to customer needs, something he admitted the company was too proud to do before. He named ASICs, co-packaged optics, physical AI and advanced packaging as possible growth areas, and wants two or three of them to eventually bring in around 10% of Intel's revenue each. On the foundry side, 18A is in volume production, while 14A has its 0.5 PDK out, with 0.9 next and 1.0 for volume production early next year. Intel had targeted October for handing the 0.9 PDK to outside customers, and Tan's "stay tuned" suggests it hasn't happened just yet. Read full story